CMC Behavior and Life Modeling Workshop

Welcome!

You are invited to attend the 2011 CMC Behavior and Life Modeling Workshop, 3-4 August 2011 at the Hilton Garden Inn in Dayton/Beavercreek, Ohio.

Workshop Summary

Although extensive processing development of CMCs over the last several decades has resulted in several commercially produced CMC systems (oxide and non-oxide), behavior and life modeling efforts for CMCs, particularly in the last decade, have been limited and largely uncoordinated. Many different models and modeling strategies have been proposed to capture the response of CMCs for a variety of service conditions, but each has inherent assumptions and limitations. This CMC Behavior and Life Modeling Workshop will bring CMC developers and OEMs together with experts in CMC behavior and life modeling and CMC characterization and non-destructive evaluation (NDE) to consider industry’s current and future CMC modeling requirements and how to best approach the Integrated Computational Materials Science and Engineering (ICMSE) of CMCs. To accomplish this objective, this workshop will review the capabilities and limitations of currently available behavior and life models, explore the CMC characterization and NDE techniques available for model development and calibration, and map out research strategies to address some of the critical modeling deficiencies and/or damage mechanisms that have yet to be adequately addressed. Special consideration will be devoted to the modeling of several of the fundamental damage mechanisms such creep, fatigue and dwell fatigue and linking these mechanisms to the distributed microstructure attributes (e.g., fiber diameter, fiber spacing, coating thickness, fiber strengths, matrix porosity, matrix phase composition, phase volume fraction, phase grain boundaries, film thickness, coating deformability). Additionally, discussion will be devoted to addressing the effects of environment, residual stresses, temperature gradients and multiaxial stress states on the various damage mechanisms in current and future modeling efforts.

Objectives

1. Define the current and future behavior and life modeling requirements of industry for the Integrated Computational Materials Science and Engineering (ICMSE) of CMCs. In particular, the modeling and design tools required for both routine design versus specialized material development and evaluation will be considered. Damage mechanisms (e.g., creep, fatigue, dwell fatigue) that are of highest priority to industry will be emphasized along with the current limitations of the CMC characterization and NDE techniques available to industry.
2. Discuss advantages and limitations of various modeling approaches including shear-lag/analytical models, fiber bundle models, fracture mechanics based models, continuum damage mechanics based models, numerical continuum mechanical models, discrete damage models, etc.
3. Discuss potential microstructure-sensitive physically based modeling techniques to account for various damage mechanisms including creep, fatigue and dwell fatigue and how these mechanisms are influenced by distributed microstructure attributes (e.g., fiber diameter, fiber spacing, coating thickness, fiber strengths, matrix porosity, matrix phase composition, phase volume fraction, phase grain boundaries, film thickness, coating deformability).
4. Consider ways to account for the effects of environment, residual stresses, temperature gradients and biaxial loading on the various damage mechanisms in current and future behavior and life models.

If you plan to attend the AFOSR NHSC, please register at: http://www.ues.com/conferences/AFOSR-NHSC